Benchtop Solder Ball Welding Machine | Vision-Guided Laser System

Product Overview

The Benchtop Solder Ball Welding Machine is a compact, high-precision laser soldering solution designed for microelectronics and advanced component assembly. Equipped with a vision-guided three-axis motion system and a high-accuracy solder ball placement head, it delivers stable, repeatable, and precise solder ball welding performance.

This system supports flexible configuration and can be easily deployed as a standalone workstation or integrated into existing production lines.

Key Features

• Vision-Guided XYZ Motion System for precise positioning and alignment
• High-Precision Solder Ball Placement Head, compatible with solder ball diameters from 70 μm to 2 mm
• Integrated Alignment Camera for real-time visual correction
• Laser Welding Technology, compatible with imported IPG lasers and domestic laser sources
• Industrial PC Control System with intuitive operation interface
• Compact Benchtop Design, easy to move and suitable for flexible production layouts
• Optional Worktable and Fixtures for various product sizes and applications

Typical Applications

• Semiconductor packaging
• IC and chip-level solder ball attachment
• Sensor and microelectronic assembly
• Precision electronic components

System Components

• Display Monitor
• Vision-Based Three-Axis Motion Platform
• Solder Ball Placement Head
• Alignment Camera
• Worktable (Optional)
• Welding Control Cabinet
• Laser Source
• Industrial Computer

Product Highlights (for quick scan)

• High accuracy
• Vision-assisted alignment
• Flexible laser configuration
• Compact benchtop footprint
• Suitable for R&D and mass production

If you need to obtain detailed information, please contact Xiamen Large Automation Technology Co.,Ltd.